True collaboration between material suppliers, OEMs and semiconductor manufacturers is necessary to develop solutions needed to maintain the pace of innovation in the global semiconductor industry.
That was the message from Ed Shober, Vice President of Advanced Materials and Delivery Systems for Air Products, who recently spoke at SEMICON Korea’s Executive Forum.
For years, materials have played a critical role in the scaling of IC devices. Looking ahead, as device geometries continue to shrink, materials will play an increasingly more critical role in semiconductor manufacturer’s success. The move to 3-D structures such as FinFETS and Vertical NAND have created additional material processing steps that require chemical mechanical planarisation (CMP), etching and atomic layer deposition to coat and fill structures.
“This increasing need for new materials is taxing all of us along the development supply chain,” said Shober. “New materials are needed, they must be integrated and the result must not impact cost per wafer, not increase capital cost, not impact yield but must enable high throughput.”
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