Eco-Snow Systems, an affiliate of The Linde Group, has developed automated cleaning technology for the Micro Electrical Mechanical Systems (MEMS) industry that utilises CO2 and helps reduce defect rates and increase device reliability.
Eco-Snow Systems is considered to be the leading supplier of automated, carbon dioxide (CO2)-based wafer cleaning tools and processes to the semiconductor industry.
Two major US MEMS manufacturers have installed the Eco-Snow VersaClean™ system for packaging component cleaning and the Eco-Snow WaferClean™ system for released device level cleaning prior to wafer dicing.
“Our customers have seen the effectiveness of the Eco-Snow automated CO2 snow cleaning technology in removing contaminants on MEMS wafer caps, released devices and packaging components,” said Joe Clark, General Manager of Eco-Snow Systems.
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